Technical Committee on 
Flexible Printed Sensors and Systems (TC-FLEPS)

Flexible and printed sensors and systems are creating new opportunities for lightweight, low-cost, and adaptable technologies. With applications spanning wearable health monitoring, soft robotics, smart packaging, structural health monitoring, environmental sensing, IoT devices, and others, flexible sensors and systems are rapidly gaining attention. Advances in novel materials, scalable fabrication and packaging, system integration, and reliability studies are driving this growth, enabling innovative solutions in the applications mentioned earlier.

The technical committee aims to foster collaboration and knowledge exchange among researchers from academia, industry, and government. Its goal is to identify and advance technologies and technical approaches that will drive progress in the field of flexible, wearable, and printed sensors and systems. These exchanges will take place through conferences, workshops, special sessions, and publications, all designed to promote discussion and innovation in technical and technological developments.