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Technical Committee on 
Flexible Printed Sensors and Systems (TC-FLEPS)

Scope

Flexible and printed sensors and systems are creating new opportunities for lightweight, low-cost, and adaptable technologies. With applications spanning wearable health monitoring, soft robotics, smart packaging, structural health monitoring, environmental sensing, IoT devices, and others, flexible sensors and systems are rapidly gaining attention. Advances in novel materials, scalable fabrication and packaging, system integration, and reliability studies are driving this growth, enabling innovative solutions in the applications mentioned earlier.

Objective

The technical committee aims to foster collaboration and knowledge exchange among researchers from academia, industry, and government. Its goal is to identify and advance technologies and technical approaches that will drive progress in the field of flexible, wearable, and printed sensors and systems. These exchanges will take place through conferences, workshops, special sessions, and publications, all designed to promote discussion and innovation in technical and technological developments.

IEEE TC-FLEPS Chair

Ravinder Dahiya
Optical Sensors cluster leader
Northeastern University, Boston, USA
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IEEE TC-FLEPS Members

Luigi Ochhipinti
Leader
University of Cambridge, UK
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Matti Mantysallo
Leader
Tampere University, Finland
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Vincenzo Vinciguerra
Leader
ST Microelectronics, Italy
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Mitradip Bhattacharya
Leader
IISER Bhopal, India
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Kourosh Kalantar Zadeh
Leader
University of Sydney, Australia
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Benjamin Tee
Leader
National University Singapore, Singapore
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Wei Gao
Leader
California Institute of Technology, USA
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Praveen Ramamoorthy
Leader
Indian Institute of Science, Bangalore, India
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Activities and Events

IEEE FLEPS 2026
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July 12-15, 2026
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Atlanta, Georgia, USA

IEEE FLEPS 2026

IEEE FLEPS 2026 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2025
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June 22-25, 2025
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Singapore

IEEE FLEPS 2025

IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2024
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June 30 - July 3, 2024
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Tampere, Finland

IEEE FLEPS 2024

IEEE FLEPS 2024 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2023
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July 9-12, 2023
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Boston, Massachusetts, USA

IEEE FLEPS 2023

IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems

IEEE FLEPS 2022
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July 10-13, 2022
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Vienna, Austria

IEEE FLEPS 2022

IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2022.

IEEE FLEPS 2021
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June 20-23, 2021
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Virtual Format

IEEE FLEPS 2021

On behalf of the IEEE FLEPS Organizing Committee, we thank you for your participation in the IEEE FLEPS 2021 virtual conference. With your help, we were able to bring together a community of about 300 attendees from around the world.

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